ECM information

[JAG1]

Mike this is fantastic your delving into this. You are a God send to all of us second Genners.

[Mopar1973Man]

Well I got to thank the gent for mentioning that he had a damaged ECM and have him mail it to me for studying. I'm going to invest a bit of effort into playing with it and seeing what I can do with it. Not known what the failure was but I'll play anyways. 

[JAG1]

How is your repair shop going?

[Mopar1973Man]

14 minutes ago, JAG1 said:

How is your repair shop going?

 

Spending most of my days running to Riggins, ID doing air conditioning repairs and recharging. 

[Chris O.]

I got some info on the Intel flash memory.

 

INTEL
specifications for 2- and 4-Mbit 5 Volt Boot Block Flash memories

EDIT: 4 Mbit = 500 KB

 

5 VOLT AUTOMOTIVE BOOT BLOCK 
FLASH MEMORY
AB28F200BR, AB28F400BR (x8/x16)

* Intel SmartVoltage Technology
- 5 V or 12 V Program/Erase
- 5 V Read Operation

* Very High Performance Read
- 80 ns Max. Access Time,
- 40 ns Max. Output Enable Time

* Low Power Consumption
- Maximum 70 mA Read Current at 5 V

* x8/x16-Selectable Input/Output Bus
- High Performance 16- or 32-bit CPUs

* Optimized Array Blocking Architecture
- One 16-KB Protected Boot Block
- Two 8-KB Parameter Blocks
- One 96-KB Main Block
- 128-KB Main Blocks
- Top or Bottom Boot Locations

* Hardware-Protection for Boot Block

* Software EEPROM Emulation with Parameter Blocks

* Automotive Temperature Operation
- –40 °C to +125 °C

* Extended Cycling Capability
- 30,000 Block Erase Cycles for Parameter Blocks
- 1,000 Block Erase Cycles for Main Blocks

* Automated Word/Byte Program and Block Erase

- Industry-Standard Command User Interface
- Status Registers
- Erase Suspend Capability

* SRAM-Compatible Write Interface
* Automatic Power Savings Feature
- 1 mA Typical ICC Active Current in Static Operation

* Reset/Deep Power-Down Input
- 0.2 μA ICCTypical
- Provides Reset for Boot Operations

* Hardware Data Protection Feature
- Write Lockout during Power Transitions

* Industry-Standard Surface Mount Packaging
- 44-Lead PSOP: JEDEC ROM Compatible

* ETOX™ Flash Technology
- 0.6 μ ETOX V Flash Technology

 

Feature 28F400BR Reference
VCC Read Voltage 5 V ± 5%, 5 V ± 10% Section 5.2
VPP Program/Erase Voltage 5 V ± 10% or 12 V ± 5%, auto-detected 
Bus-Width 8- or 16-bit 
Speed (ns) Automotive 80 
Memory Arrangement x8: 256K x 8
x16: 128K x 16
 x8: 512K x 8
x16: 256K x 16
Blocking Boot 1 x 16 KB 1 x 16 KB 
Parameter 2 x 8 KB 2 x 8 KB Figs. 2 – 5
Main 1 x 96 KB
1 x 128 KB
1 x 96 KB
3 x 128 KB
Boot Location Top or Bottom boot locations available
Locking Boot Block lockable using WP#
and/or RP#
All other blocks protectable using VPP
switch

Operating Temperature Automotive: –40 °C – +125 °C
Erase Cycling 30,000 cycles for parameter blocks;
1,000 for main and boot blocks
Packages 44-PSOP

 

http://data.datasheetlib.com/pdf1/16/45/164569/intel-corporation-ab28f400br_451394fc9c.pdf?take=binary

Edited August 2, 2016 by Chris O.

[Me78569]

So correct me if I am wrong but at 30,000 cycles on the memory that gives us ~20 years of use if the truck is started 4 times a day each day per year?  

[Dieselfuture]

24 minutes ago, Me78569 said:

So correct me if I am wrong but at 30,000 cycles on the memory that gives us ~20 years of use if the truck is started 4 times a day each day per year?  

That's why I never shut mine off, just kidding. 

[JAG1]

On ‎7‎/‎31‎/‎2016 at 11:08 AM, IBMobile said:

You can see the solder pulled away from the pin connectors on the board from all of the hot/cold cycles.  I re-solder them, put the case back together an seal it with clear RTV. 

Are there any similarities, in terms of how you have repaired Volvos ECM and this Dodge Ram Ecm? Or is it tough because its glued down to the aluminum sides like Michael says/ shows?

 

I ask because I think the pin connectors for repairing are on the side glued to the aluminum case making it tough to repair. Is that right?

Edited August 2, 2016 by JAG1

[Mopar1973Man]

You can do solder repairs and part replaces yet it just a surface mounted / solder thing. It the case is made with a crease in it so it folds up during assembly. But now unfold it to access the board and try to refold it again is crazy as you watch the aluminum case start to crack. Then attempting to get water tight seal again is also tough I bet. 

[leathermaneod]

Would it be possible to build a new board using the original as a template and then start mass producing? Of course designing a new case wouldn't be a problem

[Mopar1973Man]

Just now, leathermaneod said:

Would it be possible to build a new board using the original as a template and then start mass producing? Of course designing a new case wouldn't be a problem

 

 

If you can scrap off the original mylar circuit board some how. 

[leathermaneod]

Wouldn't it be possible to get new boards made?

[Mopar1973Man]

I'm sure someone could make new boards if they had a original board to produce from. 

[TFaoro]

Looks like you have an original board  

[leathermaneod]

My thoughts exactly ?

[Old Blue - 1998.5]

So the trick needed is how to get the circuit boards detached from the aluminum case without destroying the circuit boards.... Some type of solvent?  How about using a controlled hot air heat on the aluminum side to see if the circuit board will detach (or release) after reaching a certain controlled temperature?

[Mopar1973Man]

3 hours ago, Old Blue - 1998.5 said:

How about using a controlled hot air heat on the aluminum side to see if the circuit board will detach (or release) after reaching a certain controlled temperature?

 

I know heat is not an option consider the block temperatures and it not releasing with all the heat it sees in the life time. It's going to be solvent base for sure.

[davidc70]

Last post was 8/5/2016 ?. Did this post die ?

 

Dave

[Mopar1973Man]

Might look over here being that @Me78569 added an article about it too.